# US 8,148,179 B2 · Hermetically sealed glass package and method of fabrication

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- Number: US 8,148,179 B2
- Document ID: US8148179B2
- Status: Granted
- Kind: B2
- Application number: 12/725,648
- Filed: 2010-03-17
- Published: 2010-07-29
- Granted: 2012-04-03
- Earliest claimed: 2003-04-16
- Assignees: Corning Incorporated
- Inventors: Bruce G. Aitken; Paul S. Danielson; James E. Dickinson, Jr.; Stephan L. Logunov; Robert Morena; Mark L. Powley; Kamjula P. Reddy; Joseph F. Schroeder, III; Alexander Streltsov
- Web page: https://patentgrep.com/patent/US8148179B2

## CPC

- C03B 23/245: {Hollow glass sheets}
- C03C 3/091: containing aluminium
- C03C 3/093: containing zinc or zirconium
- C03C 3/108: containing boron
- C03C 8/04: containing zinc
- C03C 8/10: containing lead
- C03C 8/24: Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C 27/06: Joining glass to glass by processes other than fusing (fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66)
- H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- C03B: MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

## Claims

### Claim 1

A method of forming a glass package comprising:
a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;
b) providing a glass substrate that does not absorb light at the predetermined wavelength;
c) directing a laser beam comprising light at the predetermined wavelength onto a predetermined portion of the sealing glass-plate; and
wherein the predetermined portion of the sealing glass plate absorbs light from the laser beam in an amount sufficient to heat the predetermined portion and form a hermetic seal connecting the sealing glass plate and the glass substrate plate.

### Claim 2 (depends on 1)

The method according to claim 1, further comprising depositing one or more organic layers on the glass substrate plate.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the predetermined portion of the sealing glass plate swells in response to heating by the laser beam.

### Claim 4 (depends on 3)

The method according to claim 3, wherein the sealing glass plate has the following composition:
Fe2O3
0-5
(mole %)
V2O5
0-4
(mole %)
TiO2
0-5
(mole %)
CuO
0-10
(mole %)
NiO
0-3
(mole %)
B2O3
8-30
(mole %)
Al2O3
1.2-12
(mole %)
Li2O
0-2
(mole %)
Na2O
0-6
(mole %)
K2O
0-3
(mole %)
MO
0-3
(mole %) (M = Mg, Ca, Sr, Ba, Zn)
Other
0-3
(mole %)
SiO2
balance.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the sealing glass plate is formed from a borosilicate glass comprising at least one transition or rare earth metal selected from the group consisting of iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and cerium.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the glass package comprises an organic light emitting display device.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the laser beam is directed through the substrate plate onto the sealing glass plate.

### Claim 8 (depends on 1)

The method according to claim 1, wherein a coefficient of thermal expansion of the glass of the sealing glass plate is equal to or less than the coefficient of thermal expansion of the glass of the glass substrate.

### Claim 9 (depends on 1)

The method according to claim 1, wherein the sealing glass plate in step a) is a laminated glass.

### Claim 10 (depends on 9)

The method according to claim 9, wherein the laminated glass is a two layer glass comprising a layer that does not absorb light at the predetermined wavelength.

### Claim 11 (depends on 10)

The method according to claim 10, wherein a thickness of the layer that does not absorb light at the predetermined wavelength is between about 75 microns and 150 microns.

### Claim 12

A method of forming an organic light emitting diode display comprising:
a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;
b) providing a glass substrate plate that does not absorb light at the predetermined wavelength;
c) depositing one or more organic layers on the glass substrate plate;
d) heating a predetermined portion of the sealing glass plate inward of an outer edge of the sealing glass plate with a laser through the glass substrate plate; and
wherein the heating causes the predetermined portion of the sealing glass plate to swell and form a ridge that creates a gap between the sealing glass plate and the glass substrate plate, and wherein the ridge joins the sealing glass plate to the glass substrate plate with a hermetic seal.

### Claim 13 (depends on 12)

The method according to claim 12, wherein the sealing glass plate is formed from a borosilicate glass comprising at least one transition or rare earth metal selected from the group consisting of iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and cerium.

### Claim 14 (depends on 12)

The method according to claim 12, wherein the sealing glass plate has the following composition:
Fe2O3
0-5
(mole %)
V2O5
0-4
(mole %)
TiO2
0-5
(mole %)
CuO
0-10
(mole %)
NiO
0-3
(mole %)
B2O3
8-30
(mole %)
Al2O3
1.2-12
(mole %)
Li2O
0-2
(mole %)
Na2O
0-6
(mole %)
K2O
0-3
(mole %)
MO
0-3
(mole %) (M = Mg, Ca, Sr, Ba or Zn)
Other
0-3
(mole %)
SiO2
balance.

### Claim 15 (depends on 12)

The method according to claim 12, wherein the sealing glass plate in step a) is a laminated glass.

### Claim 16 (depends on 15)

The method according to claim 15, wherein the laminated glass is a two layer glass comprising a layer that does not absorb light at the predetermined wavelength.

### Claim 17 (depends on 16)

The method according to claim 16, wherein a thickness of the layer that does not absorb light at the predetermined wavelength is between about 75 microns and 150 microns.

### Claim 18

A method of forming a glass package comprising:
a) providing a sealing glass plate comprising a transition metal or rare earth element selected so that the sealing glass plate absorbs light at a predetermined wavelength;
b) providing a glass substrate that does not absorb light at the predetermined wavelength;
c) directing a laser beam comprising light at the predetermined wavelength through the glass substrate onto a predetermined portion of the sealing glass plate; and
wherein the predetermined portion of the sealing glass plate absorbs light from the laser beam in an amount sufficient to heat the predetermined portion and connect the sealing glass plate to the glass substrate plate.

### Claim 19 (depends on 18)

The method according to claim 18, wherein the sealing glass plate is lead free.