Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

A non-transitory computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for performing an RLC extraction for a three-dimensional integrated circuit (3D-IC) die, the method comprising:

• receiving a 3D-IC die description which describes the 3D-IC die, wherein the 3D-IC die comprises two or more vertically stacked 2D-IC dies which are coupled through at least one through-silicon via (TSV);
• transforming the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description and wherein the set of 2D-IC die descriptions includes a modified TSV;
• for each 2D-IC die description in the set of 2D-IC die descriptions, performing an electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file;
• and
• combining the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description.

An apparatus that performs an RLC extraction for a three-dimensional integrated circuit (3D-IC) die, comprising:

• a processor;
• a memory;
• a receiving mechanism configured to receive a 3D-IC die description which describes the 3D-IC die, wherein the 3D-IC die comprises two or more vertically stacked 2D-IC dies which are coupled through at least one through-silicon via (TSV);
• a transforming mechanism configured to transform the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description and wherein the set of 2D-IC die descriptions includes a modified TSV;
• a 2D-IC extraction tool configured to perform an electrical property extraction for each 2D-IC die description in the set of 2D-IC die descriptions to obtain a 2D-IC RLC netlist file;
• and
• a combining mechanism configured to combine the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description.