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US 8,143,654 B1Granted
Monolithic microwave integrated circuit with diamond layer
AssigneeTriQuint Semiconductor, Inc.
InventorPaul Saunier
Life of this patent
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Abstract
Embodiments of apparatuses, articles, methods, and systems for a monolithic microwave integrated circuit with a substrate having a diamond layer are generally described herein. Other embodiments may be described and claimed.
Claims12
A monolithic microwave integrated circuit (MMIC) comprising:
- a substrate including a diamond layer having a thickness of approximately 25 micrometers or less;
- an active layer coupled to the substrate, the active layer having a first side adjacent to the substrate and a second side;
- a plurality of transistors disposed at the second side of the active layer;
- a dielectric polymer layer coupled to the second side of the active layer and encompassing the plurality of transistors;
- a transmission line coupled to a top surface of the dielectric polymer layer and electrically coupled to a first transistor of the plurality of transistors by a via through the dielectric polymer layer;
- and
- a ground plane corresponding to the transmission line and electrically coupled to the plurality of transistors by one or more vias through the substrate and the active layer.
4 more elements
A system comprising:
- a monolithic microwave integrated circuit (MMIC) including
- a substrate having a diamond layer that has a thickness of approximately 25 micrometers or less;
- an active layer, coupled to the substrate, having a first side adjacent to the substrate and a second side;
- a plurality of transistors disposed at the second side of the active layer;
- a dielectric polymer layer coupled to the second side of the active layer and encompassing the plurality of transistors;
- a transmission line coupled to a top surface of the dielectric polymer layer and electrically coupled to a first transistor of the plurality of transistors by a via through the dielectric polymer layer;
- and
- a ground plane corresponding to the transmission line and electrically coupled to the plurality of transistors by one or more vias through the substrate and the active layer;
- and
- a controller configured to control the MMIC in a manner to transmit and/or receive signals via a signaling medium.
7 more elements
Dependencies are inferred from the claim text.