System and method for via structure measurement
AssigneeIndustrial Technology Research Institute
InventorsYi Sha Ku, Wei Te Hsu, Hsiu Lan Pang, Deh Ming Shyu
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Abstract
A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.
Claims21
A method for determining via structure parameters according to a diffraction spectrum of at least a via structure, comprising the steps of:
- obtaining a measured diffraction spectrum of at least a via structure;
- carrying out a calculation based upon frequency information contained in the measured diffraction spectrum;
- and
- determining at least a depth of the at least a via structure according to the calculation results.
A method for determining the bottom profile of at least a via structure according to the reflection spectrums of the at least a via structure, comprising the steps of:
- obtaining a measured diffraction spectrum of the at least a via structure;
- carrying out a calculation based upon magnitude information contained in the measured diffraction spectrum;
- and
- determining at least a bottom profile of the at least a via structure according to the calculation results.
A system for via structure measurement, comprising:
- a reflectometer, configured to collect a measured diffraction spectrum of at least a via structure;
- a simulation unit, configured to provide simulated diffraction spectrums of the at least a via structure;
- and
- a comparing unit, configured to determine at least a depth and at least a bottom profile of the at least a via structure by comparing the collected measured diffraction spectrum of at least a via structure and the simulated diffraction spectrums of the at least a via structure.
Dependencies are inferred from the claim text.