Camera module

A camera module, comprising:

• a lens unit including at least one lens;
• an image sensor package including an image sensor chip;
• a housing substantially surrounding the lens unit and the image sensor package, wherein the housing includes a body comprising an insulating material and a conductive layer disposed on an external surface of the body;
• a grounding pad disposed on a lower surface of the image sensor package, wherein the conductive layer is disposed so as to extend from lateral surfaces of the body to the first grounding pad and extend below a lower surface of the body;
• a connection terminal disposed below the image sensor package and electrically connecting the grounding pad and a main board of an electronic device;
• and
• a conductive paste disposed in a via hole in the conductive layer below the grounding pad,
• wherein the grounding pad and the housing are electrically connected by a conductive paste.