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US 8,139,131 B2Granted
Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
AssigneePanasonic Corporation
InventorsTomoko Komatsu, Toshihiro Higuchi
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Abstract
A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.
Claims26
A solid state imaging device, comprising:
- a semiconductor substrate;
- a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate;
- a plurality of color filter segments provided above the light receiving elements, the color filter segments being mutually separated;
- a transparent wall provided between the plurality of color filter segments;
- a flattening film provided over the color filter segments and the transparent wall;
- and
- a light collector provided above the color filter segments for collecting light on the light receiving elements,
- wherein the transparent wall has a refractive index lower than that of the color filter segments, and
- wherein the material of the flattening film is different from that of the transparent wall.
6 more elements
Dependencies are inferred from the claim text.