Multi-chip stack structure and signal transmission method thereof
AssigneeNational Taiwan University
InventorsHsin-Chia Lu, Guan-Ming Wu, Chun Pan
Life of this patent
Estimating the term…
Abstract
A multi-chip stack structure and a signal transmission method are disclosed in specification and drawing, where the multi-chip stack structure includes first and second chips. The first chip includes a first inductance coil with a first series capacitor, and the second chip includes a second inductance coil with a second series capacitor. The first and second inductance coils are magnetically coupled to each other. The magnetically coupled inductance coils and the capacitors constitute a coupling filter.
Claims19
A multi-chip stack structure comprising:
- a first chip comprising:
- a first inductance coil;
- and
- at least one first series capacitor connected to the first inductance coil in series;
- and
- a second chip stacked on the first chip and comprising:
- a second inductance coil magnetically coupled with the first inductance coil;
- and
- at least one second series capacitor connected to the second inductance coil in series, wherein the first and second inductance coils and the capacitors constitute a coupling filter.
A multi-chip stack structure comprising a plurality of chips that are stacked, characterized in that at least two of the chips each comprise at least one series capacitor and an inductance coil connected to each other in series, wherein the series capacitors and the inductance coils constitute a coupling filter.
Dependencies are inferred from the claim text.