Apparatus and method for input/output module that optimizes frequency performance in a circuit

An integrated circuit die comprising a module, the module comprising:

• a first plurality of signal pads;
• a plurality of buffers coupled to the first plurality of signal pads;
• a first voltage pad operable to provide only a first supply voltage to first circuit elements;
• and
• a second voltage pad operable to provide only a first ground voltage to the first circuit elements, wherein the first plurality of signal pads is interleaved between the first and the second voltage pads, wherein the first plurality of signal pads and the first and the second voltage pads comprise conductive material disposed on the integrated circuit die, wherein each of the first and the second voltage pads and each of the first plurality of signal pads is a contact on a surface of the integrated circuit die, and wherein the plurality of buffers is operable to drive signals between the integrated circuit die and at least one external device without routing the signals through any of the first plurality of signal pads.

An integrated circuit die comprising a module, the module comprising:

• a first plurality of signal pads;
• unused pads operable to provide shielding between the first plurality of signal pads;
• and
• a plurality of buffers, wherein each of the first plurality of signal pads and each of the unused pads is coupled to at least one of the plurality of buffers, wherein the first plurality of signal pads and the unused pads comprise conductive material disposed on the integrated circuit die, wherein each of the unused pads and each of the first plurality of signal pads is a contact on a surface of the integrated circuit die, and
• wherein the plurality of buffers is operable to drive signals between the integrated circuit die and at least one external device in a flip-chip mode through solder bumps without routing the signals through any of the unused pads and without routing the signals through any of the first plurality of signal pads.

A method for increasing signal-to-noise ratios of signals routed through pads on an integrated circuit die, the method comprising:

• forming a plurality of signal pads on the integrated circuit die;
• forming unused pads on the integrated circuit die, wherein the unused pads are interleaved between the plurality of signal pads such that each of the unused pads is adjacent to at least two of the plurality of signal pads, and wherein the plurality of signal pads and the unused pads comprise conductive material disposed on the integrated circuit die;
• and
• forming a plurality of buffers on the integrated circuit die, wherein each of the plurality of signal pads and each of the unused pads is coupled to at least one of the plurality of buffers, wherein each of the unused pads and each of the plurality of signal pads is a contact on a surface of the integrated circuit die, and wherein the plurality of buffers is operable to drive signals between the integrated circuit die and at least one external device without routing the signals through any of the unused pads and without routing the signals through any of the plurality of signal pads.