Apparatus for high density low cost automatic test applications
AssigneeStephen William Smith
InventorStephen William Smith
Life of this patent
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Abstract
An apparatus for testing radio frequency (RF) and/or mixed signal semiconductor devices and or modules is described. specifically described is how the distributed stimulus for RF automatic test applications, unified testhead for automatic test applications, reverse card backplane for automatic test applications, direct coaxial interface for automatic test applications, cable-free interface for automatic test applications, micromachine switch matrix for automatic test applications, device specific module high speed date for RF automatic test applications may be used within tester apparatus described herein or in other test applications. Additionally a high speed date communications test apparatus which may be used in a variety of device testers is described herein.
Claims20
A chassis tester comprising:
- a housing which contains
- an internal computing system,
- alternating current (AC) power supplies,
- a test interface configured to connect a Device Under Test (DUT),
- slots to house a multiplicity of test boards,
- a backplane configured to connect all boards,
- a bridge device configured to connect a computer to the backplane,
- electrical test modules configured to test the Device Under Test (DUT), and
- an interposer configured to connect test boards to the Device Under Test (DUT);
- wherein a distributed Radio Frequency (RF) stimulus is distributed to the Device Under Test (DUT);
- the distributed Radio Frequency (RF) stimulus comprises at least Radio Frequency (RF) signal sources and a signal splitter to replicate, convey and distribute multiple copies of the distributed Radio Frequency (RF) stimulus to one or more Devices Under Test (DUT).
Dependencies are inferred from the claim text.