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US 8,138,776 B2Granted
In-circuit test assembly
OwnerRobert C. Shelsky, Kenneth W. Graham +1inventors
InventorsRobert C. Shelsky, Kenneth W. Graham, Dennis D. Everson
Life of this patent
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Abstract
A test assembly that may provide access to signals of a circuit that includes an integrated circuit. The test assembly may include structural members that limit movement of components relative to each other.
Claims20
An interposer module configured to be assembled to and carry signals between a control board with a first array of contacts and an integrated circuit with a second array of contacts where the first array of contacts correspond in position to the second array of contacts, the interposer module comprising:
- a signal board including:
- a first side with a third array of contacts configured to accept the second array of contacts;
- a second side with a fourth array of contacts corresponding in position to the third array of contacts;
- and
- a first set of discrete conductive paths connecting each contact on the third array of contacts to the corresponding contact of the fourth array of contacts;
- and
- a socket including:
- a body with a first side and a second side;
- a set of discrete conductive means each with a proximal end and a distal end where once assembled each conductive means proximal end meets a contact of the first array of contacts and each conductive means distal end meets a contact of the fourth array of contacts;
- and
- fasteners passing through only the signal board and socket configured to prevent motion of the signal board in relation to the socket body.
8 more elements
A digital signal test system comprising:
- an integrated circuit with a first set of connection pads defining a contact configuration of positions in two dimensions;
- a primary board with a processor and a second set of connection pads in the contact configuration;
- and
- an in-circuit test assembly disposed between the integrated circuit and the primary board including:
- a lower portion with a set of discrete socket contacts in the contact configuration;
- and
- an upper portion including:
- a first set of discrete signal paths in the contact configuration where each discrete signal path includes a top pad and a bottom pad;
- a set of probe pads with each pad proximate to an edge of the upper portion;
- and
- a second set of discrete signal paths where each signal path is connected at a first end to one of the first set of signal paths and is connected at a second end to one of the set of probe pads proximate to the edge of the board;
- and
- retention means that passes through and contacts only the upper portion and the lower portion and configured to maintain a frictional connection between each discrete socket contact and each of the corresponding first set of discrete signal paths where the retention means is electrically insulated from the first set of discrete signal paths, the second set of discrete signal paths and the discrete socket contacts,
- where the integrated circuit, the primary board and the in-circuit test assembly are aligned and configured to transmit signals between the integrated circuit and the primary board through the first set of discrete signal paths and the set of discrete socket contacts.
11 more elements
A method of assembling an interposer module comprising:
- mounting a ball grid array packaged integrated circuit on a signal board with:
- a signal board top surface including a top array of pads;
- a signal board bottom surface including a bottom array of pads;
- edges defining the periphery of the signal board;
- and
- a first set of discrete signal lines connecting corresponding pads of the top array of pads to the bottom array of pads,
- where the top array of pads, the bottom array of pads and the first set of discrete signal lines are disposed in a pattern corresponding to the integrated circuit grid ball array;
- processing the signal board and ball grid array integrated circuit to bond the signal board top surface array of pads to the ball grid array of the integrated circuit;
- positioning the signal board with the ball grid array packaged integrated circuit on a socket including:
- a housing with a top surface and a bottom surface;
- an array of discrete socket contacts with distal ends at the socket housing top surface;
- and proximal ends at the socket housing bottom surface, where the socket contacts are disposed in a pattern corresponding to the integrated circuit ball grid array;
- inserting a set of pins through and contacting only the signal board and the socket housing;
- and
- retaining the set of pins in place to maintain an electrical connection between each discrete socket contact and each corresponding pad of the bottom array of pads of the signal board.
12 more elements
Dependencies are inferred from the claim text.