Light emitting device and method of manufacturing the same
AssigneeSony Corporation
InventorsYuichi Hamaguchi, Noriyuki Banno
Life of this patent
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Abstract
The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.
Claims19
A light emitting device comprising:
- a supporting base having a projection on its top face;
- a first light emitting element disposed in a region in which the projection is not formed in the top face;
- a second light emitting element disposed on the first light emitting element and the projection;
- one or plural pad electrodes each having a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member and formed on the top face of the projection;
- and
- an extraction electrode formed in a region in which the projection is not formed in the top face and electrically connected to the first light emitting element.
A light emitting device comprising:
- a conductive supporting base having a projection on its top face;
- a first light emitting element disposed in a region in which the projection is not formed in the top face;
- a second light emitting element disposed on the first light emitting element and the projection;
- one or plural pad electrodes each having a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member and formed on the top face of the projection;
- and
- an extraction electrode formed on a rear face of the supporting base and electrically connected to the supporting base.
A method of manufacturing a light emitting device comprising the steps of:
- preparing a supporting base having a projection on its top face, a first light emitting element, and a second light emitting element whose horizontal width is larger than that of the first light emitting element;
- forming one or plural pad electrodes each having, on the top face of the projection, a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member;
- forming a mount electrode for mounting the first light emitting element and an extraction electrode electrically connected to the mount electrode in a region in which the projection is not formed in the top face;
- and
- disposing the first light emitting element on the mount electrode and disposing the second light emitting element on the first light emitting element and the first connection face.
A method of manufacturing a light emitting device comprising the steps of:
- preparing a conductive supporting base having a projection on its top face, a first light emitting element, and a second light emitting element whose horizontal width is larger than that of the first light emitting element;
- forming one or plural pad electrodes each having, on the top face of the projection, a first connection face electrically connected to the second light emitting element and a second connection face electrically connected to an external conductive member;
- forming a mount electrode for mounting the first light emitting element in a region in which the projection is not formed in the top face;
- forming, on a rear face of the supporting base, an extraction electrode electrically connected to the supporting base;
- and
- disposing the first light emitting element on the mount electrode and disposing the second light emitting element on the first light emitting element and the first connection face.
Dependencies are inferred from the claim text.