Apparatus and method for packaging circuits

An electrical device, comprising a first integrated circuit, a second integrated circuit, and a bus operably connecting the first integrated circuit and the second integrated circuit, wherein the first integrated circuit includes:

• a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer, wherein the peripheral edge surface is perpendicular to the top layer and the bottom layer;
• a bond pad on the main body;
• an edge contact at the peripheral edge surface, the edge contact having an outer peripheral surface remote from the main body and an inner surface adjacent the main body, wherein the outer peripheral surface is essentially coplanar with the peripheral edge surface of the main body, wherein the edge contact is above the bottom layer such that the edge contact does not increase the height of the first integrated circuit;
• and
• a conductive line connecting the bond pad to the edge contact, wherein a tip surface of the conductive line is substantially flush with the top layer.