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US 8,138,616 B2Granted
Bond pad structure
AssigneeMediatek Inc.
InventorsTien-Chang Chang, Tao Cheng, Chien-Hui Chuang, Bo-Shih Huang
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Abstract
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.
Claims22
A bond pad structure of an integrated circuit, comprising:
- a conductive pad disposed on a first dielectric layer;
- a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer;
- and
- an electrically floating first conductive plate formed in the second dielectric layer and situated under the conductive pad.
1 more element
A bond pad structure of an integrated circuit, comprising:
- a conductive pad disposed on a first dielectric layer;
- a first conductive frame formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer;
- and
- an electrically floating first conductive piece situated under the conductive pad and surrounded by the first conductive frame.
1 more element
A bond pad structure of an integrated circuit, comprising:
- a conductive pad disposed on a first dielectric layer;
- a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug;
- and
- an electrically floating first conductive plate situated under the conductive pad.
1 more element
Dependencies are inferred from the claim text.