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US 8,138,613 B2Granted
Microelectronic devices
AssigneeMicron Technology, Inc.
InventorsYoung Do Kweon, J. Michael Brooks, Tongbi Jiang
Life of this patent
Estimating the term…
Abstract
Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.
Claims31
A microelectronic device, comprising:
- a substrate having a plurality of first contacts;
- a microelectronic die attached to the substrate, the microelectronic die including an active side, a plurality of terminals on the active side, a back side opposite the active side, and a plurality of ends extending between the active side and the back side;
- a casing covering at least a portion of the ends of the die;
- a redistribution structure on the die and the casing, the redistribution structure having a plurality of second contacts electrically coupled to corresponding terminals on the die, the second contacts being positioned outboard the die;
- a dielectric material on the redistribution structure, the dielectric material extending outboard the second contacts and configures to contact a support surface of a testing device, wherein individual second contacts are at least partially exposed through the dielectric material;
- and
- a plurality of wire-bonds electrically connecting the first contacts on the substrate to corresponding second contacts on the redistribution structure.
4 more elements
A packaged microelectronic device, comprising:
- a substrate having a plurality of first contacts;
- a known good die attached to the substrate, the known good die including an active side, a plurality of terminals on the active side and electrically coupled to corresponding first contacts on the substrate, a back side opposite the active side, and a plurality of ends extending between the active side and the back side;
- a redistribution structure coupled to the die, the redistribution structure having a plurality of second contacts electrically coupled to corresponding terminals and first contacts;
- a dielectric material disposed over at least a portion of the redistribution structure, the dielectric material extending outboard the second contacts and configured to contact a support surface of a testing device, wherein individual second contacts are at least partially exposed through the dielectric material;
- a casing covering at least a portion of the ends of the die;
- and
- an encapsulant covering the known good die, the casing, and at least a portion of the substrate.
4 more elements
A set of stacked microelectronic devices, comprising:
- a support member;
- a first microelectronic device attached to the support member, the first microelectronic device including (a) a first known good die having an active side electrically coupled to the support member, a plurality of contacts carried on the active side, a back side opposite the active side, a plurality of ends extending between the active side and the back side, and a dielectric material on at least a portion of the active side, the dielectric material extending outboard the plurality of contacts and configured to contact a support surface of a testing device, wherein individual contacts are at least partially exposed through the dielectric material;
- and (b) a first casing covering at least a portion of the ends of the first die;
- and
- a second microelectronic device attached to the first microelectronic device such that the first microelectronic device is positioned between the second microelectronic device and the support member, the second microelectronic device including (a) a second known good die having an active side electrically coupled to the support member, a back side opposite the active side, and a plurality of ends extending between the active side and the back side, and (b) a second casing covering at least a portion of the ends of the second die.
2 more elements
A set of stacked microelectronic devices, comprising:
- a support member;
- a first microelectronic device attached to the support member, the first microelectronic device including (a) a first microelectronic die having an active side electrically coupled to the support member, a plurality of contacts carried on the active side, a back side opposite the active side, a plurality of ends extending between the active side and the back side, a first footprint, and a dielectric material on the first microelectronic die, the dielectric material extending outboard the contacts and configured to contact a support surface of a testing device, wherein individual contacts are at least partially exposed through the dielectric material;
- and (b) a first casing covering at least a portion of the ends of the first die, wherein the first microelectronic device has a second footprint;
- and
- a second microelectronic device attached to the first microelectronic device such that the first microelectronic device is positioned between the second microelectronic device and the support member, the second microelectronic device including (a) a second microelectronic die having an active side electrically coupled to the support member, a back side opposite the active side, a plurality of ends extending between the active side and the back side, and a third footprint at least approximately equal to the first footprint, and (b) a second casing covering at least a portion of the ends of the second die, wherein the second microelectronic device has a fourth footprint different than the second footprint.
2 more elements
Dependencies are inferred from the claim text.