Multi-chip package with interconnected stacked chips

A system, comprising:

• a printed-circuit board (PCB);
• and
• a multi-chip package, comprising:
• a first package substrate defining a PCB interfacing surface for interfacing with the PCB and a device interfacing surface opposite the PCB interfacing surface;
• a plurality of multi-chip packages, wherein the plurality of multi-chip packages are stacked within the multi-chip package and contain a second package substrate attached to a plurality of landing pads on a first chip within each of the plurality of multi-chip packages and at least one of (i) the device interfacing surface of the first package substrate and (ii) a landing pad on a top surface of one of the plurality of multi-chip packages, and wherein the PCB interfacing surface is disposed on the PCB;
• and
• an encapsulation material encapsulating the plurality of multi-chip packages,
• wherein a second chip within one of the plurality of multi-chip packages that is farther from the second package substrate than a third chip within the stack of the one of the plurality of multi-chip packages transmits a control signal to the third chip that changes a functionality of the third chip relative to the functionality of the third chip when the second chip is not included in the one of the plurality of multi-chip packages.

A multi-chip package (MCP) comprising:

• a package substrate defining a printed circuit board (PCB) interfacing surface for interfacing with a PCB and a device interfacing surface opposite the PCB interfacing surface;
• a first device attached to the device interfacing surface, the first device having a plurality of landing pads on a top surface of the first device;
• a second device attached to the first device via electrical connections between a plurality of landing pads on a bottom surface of the second device and the plurality of landing pads on the top surface of the first device;
• a third device attached to the second device via electrical connections between a plurality of landing pads on a bottom surface of the third device and the plurality of landing pads on the top surface of the second device;
• and
• an encapsulation material encapsulating the first, second, and third devices,
• wherein a functionality of at least one of the attached devices changes when a plurality of landing pads of a first surface of the at least one of the attached devices is attached in the MCP such that the first surface is closer to the package substrate than a second surface containing a plurality of landing pads of the at least one of the attached devices relative to when the plurality of landing pads of the second surface is attached in the MCP such that the second surface is closer to the package substrate than the first surface.