Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy
AssigneeHitachi Cable, Ltd.
InventorsTakayuki Tsuji, Hiroshi Yamanobe, Hajime Nishi, Takeshi Usami, Seigi Aoyama, Masato Ito, Hiroshi Okikawa
Life of this patent
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Abstract
A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
Claims23
A wiring conductor for engagement into a connector member comprising:
- a Pb-free Sn-based material part provided at least at a part of its surface, the Sn-based material part comprising a base metal doped with an oxidation control element comprising at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg, Zr, and Ca, wherein at least one of the Sn and the oxidation control element is diffused to provide an oxidized surface on the Sn-based material part, wherein the oxidation control element oxidizes before the Sn oxidizes, and the oxidation control element that provides the oxidized surface substantially eliminates whisker formation as the wiring conductor is engaged to the connector member.
A wiring member comprising:
- a terminal comprising a wiring conductor for engagement into a connector member,
- wherein the wiring conductor comprises a Pb-free Sn-based material part at least at a part of its surface, the Sn-based material part comprises a base metal doped with an oxidation control element comprising at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca, and at least one of the Sn and the oxidation control element is diffused to provide an oxidized surface on the Pb-free Sn-based material part, wherein the oxidation control element oxidizes before the Sn oxidizes, and the oxidization control element that provides the oxidized surface substantially eliminates whisker formation as the wiring conductor is engaged to the connector member.
A connecting assembly comprising:
- a first terminal to be connected to a second terminal, the first terminal comprising a wiring conductor for engagement into a connector member of the second terminal,
- wherein the wiring conductor comprises a Pb-free Sn-based material part provided at least at a part of its surface, the Sn-based material part comprises a base metal doped with an oxidation control element comprising at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca, and at least one of the Sn and the oxidation control element is diffused to provide an oxidized surface on the Pb-free Sn-based material part wherein the oxidation control element oxidizes before the Sn oxidizes, and the oxidization control element that provides the oxidized surface substantially eliminates whisker formation as the wiring conductor is engaged to the connector member.
A wiring conductor for engagement into a connector member comprising:
- a composite material of a Pb-free Sn-based material part provided at least at its surface and a metallic material as a core, wherein a base metal of the Sn-based material part is doped with at least one oxidation control element selected from a group consisted of P, Zn, Al, Ti, and V, wherein the oxidation control element is present in a concentration ranging from 0.001 wt % to 0.5 wt % and substantially limits whisker formation to a maximum length of less than 10 microns.
Dependencies are inferred from the claim text.