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US 8,138,601 B2Granted
Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package
AssigneePanasonic Corporation
InventorsShinsuke Komatsu, Yoichiro Ueda
Life of this patent
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Abstract
The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received waveform signals, and evaluation is made on the bonded condition of an interface to be measured based on the waveform signal of the reflected wave on the reference interface.
Claims7
An ultrasonic measuring method comprising:
- receiving, at an ultrasonic probe, waveform signals of ultrasonic waves transmitted from the ultrasonic probe and reflected from a plurality of interfaces in a measurement object;
- detecting, by a calculation unit, a waveform signal of a reflected wave on a reference interface in the measurement object based on amplitudes of the waveform signals received at the ultrasonic probe;
- adjusting a position of the ultrasonic probe, based on a received waveform signal, with the ultrasonic probe and the measurement object being moved toward each other;
- and
- measuring, by the calculation unit, an interface to be measured of the measurement object, the interface to be measured being specified with the waveform signal of the reflected wave on the reference interface set as an origin,
- wherein the adjusting the position of the ultrasonic probe is performed after the detecting the waveform signal and before the measuring the interface to be measured of the measurement object.
3 more elements
Dependencies are inferred from the claim text.