Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer

A method for forming a semiconductor assembly, comprising:

• forming a first patterned polymer layer on a surface of a heat sink to define an exposed portion of the surface of the heat sink, said exposed portion not covered by said first patterned polymer layer, said exposed portion of the surface of the surface of the heat sink extending radially inward from the first patterned polymer layer, said first patterned polymer layer defining a first cell for accommodating a power semiconductor die;
• applying a solder material onto the exposed portion of the surface of the heat sink in the first cell;
• and
• positioning a power semiconductor die within the first cell on the surface of the heat sink extending radially inward from the first patterned polymer layer so that the power semiconductor die is thermally coupled to the heat sink by the solder material.