Method for manufacturing an element having electrically conductive members for application in a microelectronic package

Method for manufacturing a foil which is intended to be applied in a process of manufacturing an array of elements, wherein each element is intended to be applied in a microelectronic package having at least one microelectronic device, for the purpose of enabling the microelectronic device to be electrically contacted from outside of the package, comprising the following steps:

• providing at least one member comprising electrically conductive material and having an elongated appearance;
• providing a winding reel and winding the elongated member around the reel;
• embedding the elongated member wound around the reel in a non-conductive filling material;
• removing a portion of the filling material in order to expose a portion of the elongated members;
• and
• removing a layer of the element by cutting through the filling material and the elongated members, wherein a portion of the elongated members extending in a longitudinal direction of the elongated members is removed.

Method for manufacturing a microelectronic package, comprising the following steps:

• providing an element having at least two elongated members comprising electrically conductive material, which are at least partially embedded in a non-conductive filling material;
• providing a microelectronic device and establishing electrical connections between this device and at least two elongated members of the element;
• and
• encapsulating the microelectronic device in an encapsulation material;
• removing a portion of the non-conductive filling material in order to expose a portion of the elongated members;
• and
• removing a layer of the element by cutting through the non-conductive filling material and the elongated members, wherein a portion of the elongated members extending in a longitudinal direction of the elongated members is removed.

Method for manufacturing a microelectronic package, comprising the following steps:

• manufacturing an array of microelectronic packages by providing an array of elements, wherein each element has at least two elongated members comprising electrically conductive material, which are at least partially embedded in a non-conductive filling material;
• after providing the array of elements, providing microelectronic devices and establishing electrical connections between these devices and at least two elongated members of the elements;
• providing material for encapsulating the microelectronic devices;
• and
• dividing the array of microelectronic packages into individual microelectronic packages.

Method for manufacturing a microelectronic package, comprising the following steps:

• manufacturing an array of microelectronic packages by providing a foil comprising non-conductive material in which elongated members comprising electrically conductive material are at least partially embedded;
• after providing the foil, providing microelectronic devices and establishing electrical connections between these devices and at least two elongated members of the foil;
• providing material for encapsulating the microelectronic devices;
• and
• dividing the array of microelectronic packages into individual microelectronic packages.

Method for manufacturing an element which is intended to be applied in a microelectronic package having at least one microelectronic device, for the purpose of enabling the microelectronic device to be electrically contacted from outside of the package, comprising the following steps:

• providing at least two members comprising electrically conductive material and having an elongated appearance;
• placing the elongated members in predetermined positions with respect to each other;
• providing a non-conductive filling material for embedding at least a portion of the elongated members and fixing the elongated members in their predetermined positions with respect to each other;
• and
• removing a portion of the filling material in order to expose a portion of the elongated members;
• wherein a layer of the element is removed by cutting through the filling material and the elongated members, wherein a portion of the elongated members extending in a longitudinal direction of the elongated members is removed.