Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming an elevated contact above and between a lead and a die pad that is coplanar with the lead; connecting an integrated circuit and the lead; attaching a jumper interconnect between the elevated contact and the lead; and forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming an elevated contact above and between a lead and a die pad that is coplanar with the lead;
- connecting an integrated circuit and the lead;
- attaching a jumper interconnect between the elevated contact and the lead;
- and
- forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
A method of manufacture of an integrated circuit packaging system comprising:
- forming an elevated contact above and between a lead and a die pad that is coplanar with the lead;
- connecting an integrated circuit and the lead;
- attaching a jumper interconnect between the elevated contact and the lead;
- and
- forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with an exposed surface of the elevated contact exposed in the recess and the lead exposed from the base side.
An integrated circuit packaging system comprising:
- an elevated contact above and between a lead and a die pad that is coplanar with the lead;
- an integrated circuit connected to the lead;
- a jumper interconnect attached between the elevated contact and the lead;
- and
- an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.
Dependencies are inferred from the claim text.