Integrated circuit package system with stacked die
AssigneeSTATS ChipPAC, Ltd.
InventorsJae Hak Yee, Junwoo Myung, Byoung Wook Jang
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Abstract
An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the sacrificial substrate; forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and removing the sacrificial substrate.
Claims10
A method of manufacturing an integrated circuit package system comprising forming a trace frame including:
- fabricating a sacrificial substrate;
- forming a first series of bonding pads along a length of the sacrificial substrate;
- forming a second series of the bonding pads along a width of the sacrificial substrate;
- forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence;
- and
- removing the sacrificial substrate.
A method of manufacturing an integrated circuit package system comprising:
- forming a first stacked die package and a second stacked die package each including:
- forming a trace frame having a bonding pad,
- mounting a first integrated circuit die over the trace frame,
- mounting a second integrated circuit die over the first integrated circuit, and
- coupling electrically the bonding pad on the trace frame to the first integrated circuit die, the second integrated circuit die, or a combination thereof;
- forming a package substrate having a system bonding pad;
- mounting the first stacked die package over the package substrate;
- and
- mounting the second stacked die package over the first stacked die package.
Dependencies are inferred from the claim text.