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US 8,138,590 B2Granted
Integrated circuit package system with wire-in-film encapsulation
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Rui Huang, Heap Hoe Kuan
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; preforming a wire-in-film encapsulation having a cavity; pressing the wire-in-film encapsulation over the carrier and the integrated circuit with the cavity exposing a portion of the integrated circuit; and curing the wire-in-film encapsulation.
Claims20
A method for manufacturing an integrated circuit package system comprising:
- connecting a carrier and an integrated circuit, mounted thereover, by a bond wire;
- preforming a penetrable wire-in-film encapsulation having a cavity with orthogonal sidewalls;
- pressing the penetrable wire-in-film encapsulation over the carrier, the bond wire, and the integrated circuit with the sidewalls of the cavity having a characteristic of an intersecting bulge caused by compression and the cavity exposing a portion of the integrated circuit;
- and
- curing the penetrable wire-in-film encapsulation.
2 more elements
A method for manufacturing an integrated circuit package system comprising:
- connecting a carrier and an integrated circuit, mounted thereover, by a bond wire;
- preforming a penetrable wire-in-film encapsulation having a cavity with orthogonal sidewalls;
- pressing the penetrable wire-in-film encapsulation over the carrier, the bond wire, and the integrated circuit with the sidewalls of the cavity having a characteristic of an intersecting bulge caused by compression and the cavity exposing a bond pad of the integrated circuit;
- curing the penetrable wire-in-film encapsulation;
- and
- attaching an external interconnect below the carrier.
3 more elements
An integrated circuit package system comprising:
- a carrier;
- an integrated circuit over the carrier;
- a bond wire connecting the carrier to the integrated circuit;
- and
- a preformed penetrable wire-in-film encapsulation having a cavity with sidewalls over the carrier, the bond wire, and the integrated circuit with the sidewalls of the cavity having a characteristic of an intersecting bulge caused by compression and exposing a portion of the integrated circuit.
2 more elements
Dependencies are inferred from the claim text.