Semiconductor device and method of fabricating the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsYohei Monma, Daiki Yamada, Hidekazu Takahashi, Yuusuke Sugawara, Kazuo Nishi
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Abstract
In fabrication of a semiconductor device mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate. Then, an interposer having connection terminals are bonded to the semiconductor circuit portion. After that, the glass substrate is peeled off from the semiconductor circuit portion, and a mold resin is poured to cover the periphery of the semiconductor circuit portion from a direction of the separation plane. Then, the mold resin is heated under predetermined conditions to be hardened.
Claims10
A semiconductor device comprising:
- a first semiconductor element;
- a first electrode electrically connected to the first semiconductor element;
- a second semiconductor element operationally connected to the first semiconductor element;
- a second electrode electrically connected to the second semiconductor element;
- an interposer attached to the first electrode terminal and the second electrode terminal with an adhesive layer including conductive particles;
- a first connection terminal disposed on the interposer so as to penetrate through the interposer and electrically contact the first electrode terminal through at least one of the conductive particles;
- and
- a second connection terminal disposed on the interposer so as to penetrate through the interposer and electrically contact the second electrode terminal through at least one of the conductive particles.
A semiconductor device comprising:
- a first semiconductor element;
- a first electrode electrically connected to the first semiconductor element;
- a second semiconductor element operationally connected to the first semiconductor element;
- a second electrode electrically connected to the second semiconductor element;
- an interposer attached to a first electrode terminal and a second electrode terminal with an adhesive layer including conductive particles;
- a first connection terminal disposed on the interposer so as to penetrate through the interposer and be in contact with the first electrode terminal;
- and
- a second connection terminal disposed on the interposer so as to penetrate through the interposer and be in contact with the second electrode terminal.
Dependencies are inferred from the claim text.