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US 8,138,588 B2Granted
Package stiffener and a packaged device using the same
AssigneeTexas Instruments Incorporated
InventorBradley Morgan Haskett
Life of this patent
Estimating the term…
Abstract
A package frame for use in packaging microelectromechanical devices and/or spatial light modulators comprises a frame, a stiffener, and a heat dissipater.
Claims16
A packaged device, comprising:
- a package substrate comprising a polymeric material;
- a metallic stiffener molded into the package substrate for improving stiffness of the package substrate;
- a microelectromechanical device disposed on the package substrate;
- and
- a heat dissipater disposed between the microelectromechanical device and a supporting surface of the package substrate.
2 more elements
A packaged device, comprising:
- a package substrate comprising a polymeric material;
- a stiffener molded into the package substrate for improving stiffness of the package substrate;
- and
- a microelectromechanical device disposed on the package substrate, wherein the microelectromechanical device is a spatial light modulator device.
1 more element
A packaged device, comprising:
- a package substrate comprising a polymeric material;
- a stiffener molded into the package substrate for improving stiffness of the package substrate;
- a microelectromechanical device disposed on the package substrate;
- and
- a heat dissipater disposed between the microelectromechanical device and a supporting surface of the package substrate wherein the heat dissipater comprises a metallic material that comprises Kovar.
2 more elements
A packaged device, comprising:
- a package substrate comprising a polymeric material;
- a stiffener molded into the package substrate for improving stiffness of the package substrate;
- a micromirror device disposed on the package substrate;
- and
- a heat dissipater disposed between the micromirror device and a supporting surface of the package substrate wherein the heat dissipater comprises a metallic material that comprises Kovar.
2 more elements
Dependencies are inferred from the claim text.