Device including two mounting surfaces
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
A device including two mounting surfaces. One embodiment provides a power semiconductor chip and having a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. A first external contact element and a second external contact element, are both electrically coupled to the first electrode of the semiconductor chip. A third external contact element and a fourth external contact element, both electrically coupled to the second electrode of the semiconductor chip. A first mounting surface is provided on which the first and third external contact elements are disposed. A second mounting surface is provided on which the second and fourth external contact elements are disposed.
Claims19
A device, comprising:
- exactly one semiconductor chip, the semiconductor chip being a power semiconductor chip and comprising a first electrode on a first surface and a second electrode on a second surface opposite to the first surface;
- a first external contact element and a second external contact element, both electrically coupled to the first electrode of the semiconductor chip;
- a third external contact element and a fourth external contact element, both electrically coupled to the second electrode of the semiconductor chip;
- a first mounting surface on which the first and third external contact elements are disposed;
- and
- a second mounting surface on which the second and fourth external contact elements are disposed,
- wherein the exactly one semiconductor chip is arranged above the first and third external contact elements, the second and fourth external contact elements are arranged above the exactly one semiconductor chip, and at least a portion of the second external contact element is arranged within a periphery of the third external contact element.
A system, comprising:
- a first device and a second device, each of the first and second devices comprising:
- a power semiconductor chip comprising a first electrode on a first surface and a second electrode on a second surface opposite to the first surface;
- a first external contact element and a second external contact element, both electrically coupled to the first electrode of the power semiconductor chip;
- a third external contact element and a fourth external contact element, both electrically coupled to the second electrode of the power semiconductor chip;
- a first mounting surface on which the first and third external contact elements are disposed;
- and
- a second mounting surface on which the second and fourth external contact elements are disposed;
- and
- a circuit board, the first device mounted on the circuit board with its first mounting surface facing the circuit board and the second device mounted on the circuit board with its second mounting surface facing the circuit board,
- wherein the first device and the second device are horizontally arranged side by side on the circuit board and a cooling element is placed over both the first device and the second device.
A system, comprising:
- a first device and a second device, each of the first and second devices comprising:
- a power semiconductor chip comprising a first electrode on a first surface and a second electrode on a second surface opposite to the first surface;
- a first external contact element and a second external contact element, both electrically coupled to the first electrode of the power semiconductor chip;
- a third external contact element and a fourth external contact element, both electrically coupled to the second electrode of the power semiconductor chip;
- a first mounting surface on which the first and third external contact elements are disposed;
- and
- a second mounting surface on which the second and fourth external contact elements are disposed;
- a circuit board, the first device mounted on the circuit board with its first mounting surface facing the circuit board and the second device mounted on the circuit board with its second mounting surface facing the circuit board;
- a cooling element placed over the second mounting surface of the first device and over the first mounting surface of the second device;
- and
- an electrically insulating layer arranged between the first and second devices and the cooling element.
Dependencies are inferred from the claim text.