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US 8,138,586 B2Granted
Integrated circuit package system with multi-planar paddle
AssigneeSTATS ChipPAC, Ltd.
InventorsArnel Trasporto, Sze Min Wong, Henry D. Bathan, Zigmund Ramirez Camacho
Life of this patent
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Abstract
An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle.
Claims13
A method for manufacturing an integrated circuit package system comprising:
- forming a multi-planar paddle having an outer uplift rim;
- attaching an integrated circuit over the uplift rim of the multi-planar paddle, the integrated circuit providing an overhang of the integrated circuit over the multi-planar paddle with improved spacing between the integrated circuit and multiple rows of leads along a side of the integrated circuit;
- and
- forming an encapsulation on the multi-planar paddle and on the integrated circuit, a bottom surface of the multi-planar paddle exposed from the encapsulation.
1 more element
An integrated circuit package system comprising:
- a multi-planar paddle having an outer uplift rim;
- and
- an integrated circuit over the uplift rim of the multi-planar paddle, the integrated circuit includes an overhang of the integrated circuit over the multi-planar paddle with improved spacing between the integrated circuit and multiple rows of leads along a side of the integrated circuit;
- and
- an encapsulation formed on the multi-planar paddle and on the integrated circuit, a bottom surface of the multi-planar paddle exposed from the encapsulation.
2 more elements
Dependencies are inferred from the claim text.