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US 8,138,584 B2Granted
Method of forming a semiconductor package and structure thereof
AssigneeFreescale Semiconductor, Inc.
InventorsZhi-jie Wang, Jian-yong Liu
Life of this patent
Estimating the term…
Abstract
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination of a conductive glue (38, 48, 52) and a metal paint (36, 50). A wire loop (30) is coupled to the conductive layer and a leadframe (10).
Claims19
A semiconductor package comprising:
- a leadframe having a flag and a lead finger;
- a semiconductor die attached to the flag and electrically coupled to the lead finger;
- an encapsulant that covers the semiconductor die and at least a portion of the leadframe;
- a conductive layer formed over at least a portion of an outer surface of the encapsulant for providing at least one of electromagnetic and radio frequency shielding, wherein the conductive layer comprises a combination of a shielding metal layer and a conductive glue layer, and wherein an entire inner surface of the conductive layer is in contact with the outer surface of the encapsulant;
- and
- a wire electrically coupling the leadframe to the conductive layer.
3 more elements
A method of forming a semiconductor package comprising the steps of:
- providing a leadframe having a flag and a plurality of lead fingers;
- attaching a semiconductor die to the flag;
- electrically coupling the semiconductor die to the lead fingers;
- forming an additional wire loop that is electrically connected to the leadframe;
- encapsulating the semiconductor die and at least a portion of the additional wire loop with an encapsulant, wherein another portion of the additional wire loop extends beyond the encapsulant and is exposed;
- and
- forming a conductive layer over at least a portion of an outer surface of the encapsulant, wherein the conductive layer provides at least one of electromagnetic and radio frequency shielding, wherein the conductive layer comprises a combination of a shielding metal and a conductive glue, wherein an entire inner surface of the conductive layer is in contact with the outer surface of the encapsulant, and the another portion of the additional wire loop contacts the conductive layer, thereby electrically coupling the leadframe to the conductive layer.
4 more elements
A method of forming a semiconductor package comprising the steps of:
- providing a leadframe panel having first and second leadframes, each of the first and second leadframes including a flag and a plurality of lead fingers;
- attaching first and second semiconductor dies respectively to the flags of the first and second leadframes;
- electrically coupling the first and second semiconductor dies respectively to the fingers of the first and second leadframes;
- providing a wire bond having a first end and a second end;
- electrically coupling the first end of the wire bond to a lead finger of the first leadframe and the second end of the wire bond to a lead finger of the second leadframe;
- forming an encapsulant over the first and second semiconductor dies and the wire bond, wherein a portion of the wire bond extends beyond the encapsulant such that said portion of the wire bond is exposed;
- forming a conductive layer over at least a portion of an outer surface of the encapsulant and the wire bond, wherein the conductive layer provides at least one of electromagnetic and radio frequency shielding, wherein the conductive layer is electrically coupled to the exposed portion of the wire bond, wherein an entire inner surface of the conductive layer is in contact with the encapsulant, and wherein the conductive layer comprises a combination of a shielding metal and a conductive glue;
- and
- singulating the leadframe panel to form first and second packaged devices.
6 more elements
Dependencies are inferred from the claim text.