Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
AssigneeToray Industries, Inc.
InventorsYukitsuna Konishi, Hirohumi Tsuchiya, Shinsuke Kimura, Yasushi Sawamura
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Abstract
In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.
Claims15
An adhesive composition for electronic components comprising (a) a thermoplastic resin, (b) an epoxy resin, (c) a hardener, and (d) an organopolysiloxane, wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less and the organopolysiloxane (d) contains bifunctional siloxane units and tri- or higher functional siloxane units.
Dependencies are inferred from the claim text.