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US 8,138,566 B1Granted
Integrated circuit chip made secure against the action of electromagnetic radiation
AssigneeGemalto SA
InventorsRobert A. Leydier, Béatrice Bonvalot
Life of this patent
Estimating the term…
Abstract
A chip for a chip-incorporating portable article having a card format, such as for smartcards. The chip includes a silicon substrate layer having integrated circuits in its active face defining a central processor unit and memories. The chip also includes physical means for providing physical protection against the action of electromagnetic radiation in the infrared range of wavelength longer than 1 μm.
Claims29
A chip for a chip-containing portable article comprising:
- a silicon substrate layer having an active face with circuits integrated therein defining a central processor unit and memories;
- an additional layer of monocrystalline silicon that:
- covers a portion of an integrated circuit integrated on said active face;
- comprises physical means for providing physical protection against the action of electromagnetic radiation in the infrared range at a wavelength longer than 1 μm;
- and
- a bonding layer in contact with the active face and the additional layer such that at least one contact pad of the chip is exposed by a via opening in the additional layer and the bonding layer or a bonding layer in contact with the active face and the additional layer such that the entire silicon substrate layer is covered by the additional layer.
3 more elements
A portable article provided with a chip comprising:
- a silicon substrate layer having an active face with circuits integrated therein defining a central processor unit and memories;
- and
- an additional layer of moncrystalline silicon that:
- covers at least a portion of an integrated circuit integrated on said active face;
- comprises physical means for providing physical protection against the action of electromagnetic radiation in the infrared range at a wavelength longer than 1 μm;
- and
- a bonding layer in contact with the active face and the additional layer such that at least one contact pad of the chip is exposed by a via opening in the additional layer and the bonding layer or a bonding layer in contact with the active face and the additional layer such that the entire silicon substrate layer is covered by the additional layer.
4 more elements
Dependencies are inferred from the claim text.