Microstructure, micromachine, and manufacturing method of microstructure and micromachine
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsMayumi Yamaguchi, Konami Izumi
Life of this patent
Estimating the term…
Abstract
Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.
Claims23
A microstructure comprising:
- a spacer layer which is selectively formed over a protective substrate,
- and a layer which is formed over the spacer layer,
- wherein:
- the layer includes a fixed portion formed over the spacer layer and a movable portion below which the spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the layer and the protective substrate, and
- the protective substrate is a light-transmitting substrate.
A microstructure comprising
- a first spacer layer which is selectively formed over a first protective substrate,
- a first layer formed over the first spacer layer,
- a second spacer layer which is selectively formed over the first layer, and
- a second protective substrate formed over the second spacer layer,
- wherein:
- the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and
- the first protective substrate is a light-transmitting substrate.
A micromachine comprising:
- an electric circuit formed over a protective substrate;
- and
- a microstructure which is electrically connected to the electric circuit,
- wherein:
- the electric circuit includes a spacer layer which is selectively formed over the protective substrate and a layer formed over the spacer layer,
- the layer includes a fixed portion provided over the spacer layer and a movable portion below which the spacer layer is not provided, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the layer and the protective substrate, and
- the protective substrate is a flexible substrate.
A micromachine comprising:
- an electric circuit formed over a first protective substrate;
- and
- a microstructure which is electrically connected to the electric circuit,
- wherein:
- the electric circuit includes a semiconductor element,
- the microstructure includes a first spacer layer which is selectively formed over the first protective substrate, a first layer formed over the first spacer layer, a second spacer layer which is selectively formed over the first layer, and a second protective substrate formed over the second spacer layer,
- the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and
- the first protective substrate is a flexible substrate.
Dependencies are inferred from the claim text.