Electrostatic discharge protection device and method of fabricating same

A silicon control rectifier, comprising:

• silicon body formed in a silicon layer in direct physical contact with a buried oxide layer of a silicon-on-insulator substrate, a top surface of said silicon layer defining a horizontal plane;
• an anode of said silicon control rectifier formed in a first region of said silicon body and a cathode of said silicon control rectifier formed in an opposite second region of said silicon body;
• a doped third region and a doped fourth region, said third region between and abutting said first and fourth regions, said fourth region between and abutting said second and third regions, said third region not abutting said second region, said fourth region not abutting said first region, said first and fourth regions doped an opposite type from said second and said second and third regions, second, third and fourth regions in direct physical contact with said buried oxide layer;
• a single contiguous gate electrode having (i) a first portion overlapping a less than whole portion of said first region and a less than whole portion of said third region and (ii) a second portion overlapping a less than whole portion of said second region, overlapping a less than whole portion of said third region and overlapping all of said fourth region between said second and third regions;
• wherein a path of current flow from said anode to said cathode passes through said third and fourth regions is only in a single horizontal direction parallel to said horizontal plane.