Semiconductor device with an electrode as an alignment mark, and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsHidetoshi Koike, Yusuke Kohyama
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Abstract
A semiconductor device includes a semiconductor substrate, a back side drawn electrode formed by embedding a first conductive material in a contact hole penetrating the semiconductor substrate through an insulating film formed to include a uniform thickness, used also as an alignment mark, and configured to draw out an electrode to the back side of the semiconductor substrate. The device further includes a pad provided on the back side of the semiconductor substrate, and connected to the back side drawn electrode.
Claims15
A semiconductor device comprising:
- a semiconductor substrate;
- a back side drawn electrode formed by embedding a first conductive material in a contact hole penetrating the semiconductor substrate through an insulating film formed to include a uniform thickness, used also as an alignment mark, and configured to draw out an electrode to the back side of the semiconductor substrate;
- and
- a pad provided on the back side of the semiconductor substrate, and connected to the back side drawn electrode,
- wherein the electrode includes a second conductive material having a resistance which is lower than that of the first conductive material.
A method of manufacturing a semiconductor device configured to form a back side drawn electrode which is used to draw out an electrode used also as an alignment mark to the back side of a semiconductor substrate comprising:
- forming a through hole in the semiconductor substrate;
- forming an insulating film with a uniform thickness on an inner wall of the through hole;
- and
- embedding a first conductive material in the through hole through the insulating film to thereby form a contact layer.
Dependencies are inferred from the claim text.