CMOS image sensor having a crosstalk prevention structure
AssigneeSamsung Electronics Co., Ltd.
InventorsWon-Je Park, Young-Hoon Park, Ui-Sik Kim, Dae-Cheol Seong, Yeo-Ju Yoon, Bo-Bae Keang
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AssigneeSamsung Electronics Co., Ltd.
InventorsWon-Je Park, Young-Hoon Park, Ui-Sik Kim, Dae-Cheol Seong, Yeo-Ju Yoon, Bo-Bae Keang
Estimating the term…
In a method of manufacturing a CMOS image sensor, a P type epitaxial layer is formed on an N type substrate. A deep P+ type well layer is formed in the P type epitaxial layer. An N type deep guardring well is formed in a photodiode guardring region. The N type deep guardring region makes contact with the N type substrate and also be connected with an operational voltage terminal. A triple well is formed in a photodiode region and a peripheral circuit region. The triple well is used for forming a PMOS and an NMOS having different operational voltages. An isolation region is formed in the photodiode region. The isolation region in the photodiode region has a depth different from a depth of an isolation region in the peripheral circuit region.
A CMOS image sensor comprising:
Dependencies are inferred from the claim text.