Package configurations for low EMI circuits

An assembly, comprising:

• a first transistor encased in a first package, the first transistor comprising a source, a gate, and a drain all on a first side of the first transistor, the first package comprising a first conductive structural portion;
• and
• a second transistor encased in a second package, the second package comprising a second conductive structural portion;
• wherein
• a source of the first transistor is electrically connected to the first conductive structural portion and a drain of the second transistor is electrically connected to the second conductive structural portion.

An electronic component comprising a transistor encased in a package, the package surrounding the transistor;

• wherein
• the transistor comprises a source electrode, a gate electrode, a drain electrode, and a semiconductor layer, the electrodes all being on a first side of the semiconductor layer;
• the package comprises a gate lead, a source lead, a drain lead, and a case including an insulating portion and an electrically conductive structural portion;
• the gate lead, the source lead, and the drain lead all extend from the insulating portion of the case;
• and
• the source lead is between the gate lead and the drain lead.

An electronic component comprising a transistor encased in a package, the package surrounding the transistor;

• wherein
• the package comprises a gate lead, a source lead, a drain lead, and a case including an insulating portion and an electrically conductive structural portion:,
• the gate lead, the source lead, and the drain lead all extend from the insulating portion of the case;
• the source lead is between the gate lead and the drain lead;
• and
• the transistor is a first transistor and the package is a first package, the electronic component further comprising a second transistor encased in a second package, the second package including a source lead, a gate lead, and a drain lead, the source lead of the second package being electrically connected to the drain lead of the first package.