Light-emitting diode package
AssigneeEverlight Electronics Co., Ltd.
InventorsYi-Tine Chiu, Chung-Chuan Hsieh
Life of this patent
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Abstract
An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first electrodes and the pair of second electrodes are electrically connected with the LED chip. The pair of first electrodes and the pair of second electrodes are located outside the encapsulant. The encapsulant has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface.
Claims18
A light-emitting diode (LED) package, comprising:
- a leadframe having a pair of first electrodes and a pair of second electrodes;
- an LED chip disposed on the leadframe, the pair of first electrodes and the pair of second electrodes being electrically connected with the LED chip;
- and
- an encapsulant encapsulating a portion of the leadframe and the LED chip, the pair of first electrodes and the pair of second electrodes being located outside the encapsulant, the encapsulant having a top surface, a bottom surface, a first side surface, a second side surface opposite to the first side surface, a first protruding portion located on the first side surface, and a second protruding portion located on the second side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface;
- wherein the pair of first electrodes comprise a first positive electrode and a first negative electrode electrically insulated from the first positive electrode, while the pair of second electrodes comprise a second positive electrode and a second negative electrode electrically insulated from the second positive electrode.
A light-emitting diode (LED) module, comprising:
- a circuit substrate;
- and
- a plurality of light-emitting diode (LED) packages electrically connected to the circuit substrate, each LED package comprising:
- a leadframe having a pair of first electrodes and a pair of second electrodes;
- an LED chip disposed on the leadframe, the pair of first electrodes and the pair of second electrodes being electrically connected with the LED chip;
- and
- an encapsulant encapsulating a portion of the leadframe and the LED chip, the pair of first electrodes and the pair of second electrodes being located outside the encapsulant, the encapsulant having a top surface, a bottom surface, a first side surface, a second side surface opposite to the first side surface, a first protruding portion located on the first side surface, and a second protruding portion located on the second side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface,
- wherein the pair of first electrodes comprise a first positive electrode and a first negative electrode electrically insulated from the first positive electrode, while the pair of second electrodes comprise a second positive electrode and a second negative electrode electrically insulated from the second positive electrode,
- wherein the pair of the first electrodes include a pair of first electrode portions disposed on the first side surface and a pair of second electrode portions disposed on the bottom surface;
- wherein when the pair of first electrode portions of the LED package is mounted to the circuit substrate, a side surface of the first protruding portion is contacted with the circuit substrate, and the LED package provides a side-view illumination;
- wherein when the pair of second electrode portions of the LED package is mounted to the circuit substrate, a bottom surface of the first protruding portion is contacted with the circuit substrate, and the LED package provide a top-view illumination.
Dependencies are inferred from the claim text.