LED package with metal PCB
AssigneeSeoul Semiconductor Co., Ltd.
InventorsSuk Jin Kang, Do Hyung Kim
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Abstract
The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.
Claims20
A light emitting diode package, comprising:
- a first metal plate comprising a first electrode and a second electrode spaced apart from each other;
- a second metal plate comprising a first terminal and a second terminal spaced apart from each other;
- an insulating layer interposed between the first metal plate and the second metal plate, the insulating layer having a first via hole and a second via hole formed through itself;
- a first conductive portion filled in the first via hole to connect between the first electrode and the first terminal;
- a second conductive portion filled in the second via hole to connect between the second electrode and the second terminal;
- a hole cup layer disposed on the first metal plate, the hole cup layer comprising an opening that exposes the first electrode and second electrode;
- a light emitting chip positioned entirely within the opening;
- and
- a molding member disposed on the hole cup layer to cover the opening.
A light emitting diode package, comprising:
- a first metal plate comprising a first electrode and a second electrode spaced apart from each other;
- a second metal plate comprising a first terminal and a second terminal spaced apart from each other;
- an insulating layer interposed between the first metal plate and the second metal plate, the insulating layer having a first via hole and a second via hole formed through itself;
- a first conductive portion filled in the first via hole to connect between the first electrode and the first terminal;
- a second conductive portion filled in the second via hole to connect between the second electrode and the second terminal;
- a light emitting chip arranged directly on the first electrode;
- and
- a molding member comprising a hemispherical shape and an extension portion covering a top surface of the first metal plate,
- wherein the entire first metal plate is substantially flat,
- wherein the extension portion is integrally formed with the molding member, and
- wherein an outer side surface of the extension portion is substantially flush with an outer side surface of the insulating layer.
Dependencies are inferred from the claim text.