Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate
AssigneeVisEra Technologies Company Limited
InventorsTzy-Ying Lin, Chun-Chiang Yen, Wu-Cheng Kuo
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Abstract
Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.
Claims11
A light emitting device, comprising:
- an array of light emitting diode dies attached to a substrate, wherein the orientations of each of the light emitting diode dies are different;
- at least one bond pad on each of the light emitting diode dies in the array;
- a luminescent material layer conformally covering the array of light emitting diode dies, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad;
- and
- at least one wirebond electrically connecting the at least one bond pad and a contact pad on the substrate.
Dependencies are inferred from the claim text.