LED chip package structure with different LED spacings and a method for making the same
AssigneeHarvatek Corporation
InventorsBily Wang, Shih-Yu Wu, Wen-Kuei Wu
Life of this patent
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Abstract
An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from each other by totally different spacing or partially different spacing. For example, the spacings between each two LED chips are from rarefaction to condensation, from condensation to rarefaction, from center rarefaction to outer condensation, from center condensation to outer rarefaction, alternate rarefaction and condensation, or alternate condensation and rarefaction. The package colloid unit covers the LED chips.
Claims22
A LED chip package structure with different LED spacings, comprising:
- a substrate unit;
- a light-emitting unit having a plurality of LED chips electrically arranged on the substrate unit, wherein the LED chips are separated from each other by different spacings;
- and
- a package colloid unit covering the LED chips, wherein the package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips.
A LED chip package structure, comprising:
- a substrate unit;
- a light-emitting unit having a plurality of LED chips electrically arranged on the substrate unit, wherein the LED chips are separated from each other by different spacings;
- a package colloid unit covering the LED chips;
- and
- a frame unit covering the package colloid unit for only exposing a lateral side of the package colloid unit.
Dependencies are inferred from the claim text.