Heat processing method, computer-readable storage medium, and heat processing apparatus

A computer program product, comprising:

• a computer-readable storage medium storing a program for causing a computer to execute control when implementing a heat processing method by mounting a substrate on a heat processing plate of a heat processing apparatus, said heat processing method including
• measuring an amount of deformation of the substrate
• setting suction start timings via a plurality of suction ports in a substrate mounting surface of the heat processing plate, based on the measured amount of deformation of the substrate to be heat-processed;
• when mounting the substrate onto the heat processing plate, sucking the substrate via the suction ports based on the set suction start timings to attract the substrate onto the heat processing plate;
• and
• heat-processing the substrate on the heat processing plate;
• and
• setting suction end timings via the suction ports such that the suction end timing via at least one of the suction ports is different from the suction end timings via another suction port, wherein
• in said step of setting suction start timings, the suction start timing via a suction port corresponding to a portion of the substrate deformed upward is set to be earlier than the suction start timing via another suction port.

A substrate heat processing apparatus, comprising:

• a heat processing plate for mounting and heat-processing a substrate thereon;
• a warpage measuring unit configured to measure an amount of deformation of the substrate;
• a plurality of suction ports formed in a substrate mounting surface of said heat processing plate for sucking the substrate;
• and
• a control unit configured to set suction start timings via said suction ports based on the measured amount of deformation of the substrate to be heat-processed such that the suction start timing via at least one of the suction ports is different from the suction start timing via another suction port and, when mounting the substrate on said heat processing plate, to allow the substrate to be sucked via said suction ports in sequence based on the set suction start timings to attract the substrate onto said heat processing plate,
• wherein said control unit sets suction end timings via the suction ports such that the suction end timing via at least one of the suction ports is different from the suction end timings via another suction port.