Lead-embedded metallized ceramics substrate and package
AssigneeTokuyama Corporation
InventorsMasakatsu Maeda, Yasuyuki Yamamoto
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Abstract
A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.
Claims7
A metallized ceramics substrate comprising:
- a ceramics body;
- a wiring pattern formed on one surface of said ceramics body;
- a lead electrically-connected to said wiring pattern;
- and an outflow prevention member on said wiring pattern,
- wherein said ceramics body has a through-hole,
- said lead penetrates said through-hole and sticks out from another surface of said ceramics body,
- said lead is fixed by filling an electroconductive filler between said lead and said through-hole, so that airtightness is kept,
- said outflow prevention member is provided as a protrusion on said wiring pattern and limits the area to fill said electroconductive filler, and said wiring pattern has a triple-layer structure comprising:
- a lower layer;
- a middle layer;
- and an upper layer,
- Wherein said lower layer is formed by coating a conductive paste containing ceramics powder, said middle layer is formed by coating a conductive paste which does not contain ceramics powder, and said upper layer is formed by plating.
Dependencies are inferred from the claim text.