Mounting structure
AssigneePanasonic Corporation
InventorsKoso Matsuno, Hidenori Miyakawa, Shigeaki Sakatani
Life of this patent
Estimating the term…
Abstract
A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.
Claims14
A mounting structure, comprising:
- a flat electronic component including a plurality of lands provided on the undersurface of said electronic component, and
- a circuit board including a plurality of terminals provided on the mounting surface of said circuit board so as to correspond respectively to said plurality of lands, said plurality of terminals and said plurality of lands being respectively bonded together with a solder,
- wherein said circuit board further comprises a flux holding means for holding a flux separated from said solder, said flux holding means being provided in the proximity of at least one of said plurality of terminals of said circuit board,
- said flux holding means is a dummy electrode disposed so as to surround at least one of said plurality of terminals, and
- said dummy electrode is disposed on the whole area of said circuit board excluding said terminals and said lands.
A circuit board for forming a mounting structure together with a flat electronic component, the circuit board comprising a plurality of terminals provided on the mounting surface of said circuit board so as to correspond respectively to a plurality of lands provided on the undersurface of said flat electronic component,
- wherein said circuit board further comprises a flux holding means for holding a flux separated from a solder used for bonding said plurality of terminals and said plurality of lands together, said flux holding means being provided in the proximity of at least one of said plurality of terminals,
- said flux holding means is a dummy electrode disposed so as to surround at least one of said plurality of terminals, and
- said dummy electrode is disposed on the whole area of said circuit board excluding said terminals and said lands.
Dependencies are inferred from the claim text.