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US 8,138,424 B2Granted
Wiring substrate including a reinforcing structural body
AssigneeShinko Electric Industries Co., Ltd.
InventorHiroshi Shimizu
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes (i) a wiring forming region in which wiring layers and an insulating layer are alternately stacked, (ii) an outer periphery region around the wiring forming region, and (iii) a reinforcing structural body having (a) a first reinforcing member continuously extending along said outer periphery region, and (b) a second reinforcing member extending in a thickness direction and being engaged with the first reinforcing member.
Claims6
A wiring substrate, comprising:
- (i) a wiring forming region in which wiring layers and insulating layers are alternately stacked;
- (ii) an outer periphery region around the wiring forming region;
- and
- (iii) a solid reinforcing structural body having
- (a) a first reinforcing member continuously extending along said outer periphery region, and
- (b) a second reinforcing member extending in a thickness direction and being engaged with the first reinforcing member, wherein
- said first reinforcing member is composed of reinforcing patterns having a multilayer structure and continuously extending within planes of respective insulating layers, and being formed along each side of said wiring substrate, said second reinforcing member is composed of reinforcing pillars buried in said insulating layer sandwiched between said reinforcing patterns of different layers, said reinforcing patterns and said reinforcing pillars are bonded together to form the solid reinforcing structural body and formed so as to surround said wiring forming region,
- one surface of said wiring substrate is a mounting surface of an electronic component,
- another surface of said wiring substrate is a mounting surface of an external device, and
- the first reinforcing member and the second reinforcing member are electrically separated from the wiring layers in the wiring forming region.
7 more elements
A wiring substrate comprising:
- (i) a wiring forming region in which wiring layers and insulating layers are alternately stacked;
- (ii) an outer periphery region around the wiring forming region;
- and
- (iii) a reinforcing structural body having
- (a) a first reinforcing member continuously extending along said outer periphery region, and
- (b) a second reinforcing member extending in a thickness direction and being engaged with the first reinforcing member,
- wherein said first reinforcing member is composed of reinforcing patterns having a multilayer structure and continuously extending within planes of respective insulating layers, and being formed along each side of said wiring substrate, said second reinforcing member is composed of reinforcing pillars buried in said insulating layer sandwiched between said reinforcing patterns of different layers, said reinforcing patterns and said reinforcing pillars are formed so as to surround said wiring forming region, and one surface of said wiring substrate is a mounting surface of an electronic component and another surface of said wiring substrate is a mounting surface of an external device
- wherein within the same said layer, a plurality of said reinforcing patterns is arranged so as to form a grating.
5 more elements
An electronic component device, comprising:
- a wiring substrate having:
- (i) a wiring forming region in which wiring layers and insulating layers are alternately stacked;
- (ii) an outer periphery region around the wiring forming region;
- and
- (iii) a reinforcing structural body having
- (a) a first reinforcing member continuously extending along said outer periphery region, and
- (b) a second reinforcing member extending in a thickness direction and being engaged with the first reinforcing member,
- wherein said first reinforcing member is composed of reinforcing patterns having a multilayer structure and continuously extending within planes of respective insulating layers, and being formed along each side of said wiring substrate, said second reinforcing member is composed of reinforcing pillars buried in said insulating layer sandwiched between said reinforcing patterns of different layers, said reinforcing patterns and said reinforcing pillars are formed so as to surround said wiring forming region, and one surface of said wiring substrate is a mounting surface of an electronic component and another surface of said wiring substrate is a mounting surface of an external device;
- and
- electronic components connected to the outermost wiring layer of said wiring substrate.
7 more elements
Dependencies are inferred from the claim text.