Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSe-Ho Park, Ki-Hyun Kim, Seok-Myong Kang, Young-Min Lee
Life of this patent
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Abstract
A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.
Claims9
A printed circuit board comprising:
- a circuit pattern formed by printing at least one of conductive ink and conductive paste on a substrate, and performing at least one of sintering a layer of the conductive ink and curing a layer of the conductive paste, by applying heat;
- a primary plating layer formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern;
- and
- a secondary plating layer formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.
The printed circuit board of claim l, wherein performing a sintering of the layer of the conductive ink comprises:
- performing a drying process at a temperature ranging between 100° C. and 130° C. for a time ranging between 10 and 30 minutes;
- and
- performing a sintering process at a temperature ranging between 130° C. and 260° C. for a time ranging between 5 and 20 minutes.
Dependencies are inferred from the claim text.