Flexible, low dielectric loss composition and method for preparing the same
AssigneeIndustrial Technology Research Institute
InventorsShur-Fen Liu, Meng-Huei Chen, Man-Chun Yu
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Abstract
A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.
Claims27
A flexible, low dielectric loss composition, used to fabricate a flexible substrate, comprising:
- SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition;
- at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group;
- and
- a thermosetting organic resin.
A method for preparing a flexible, low dielectric loss composition, comprising:
- providing at least one thermosetting organic resin dissolved in a solvent to obtain a solution;
- adding at least one flexile macromolecule, a curing agent, and a catalyst into the solution wherein the flexile macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group;
- and
- adding SrTiO3 and/or Ba(Sr)TiO3 ceramic particle into the solution, wherein the SrTiO3 and/or Ba(Sr)TiO3 ceramic particle has a particular size between 30 nm and 2 μm.
Dependencies are inferred from the claim text.