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US 8,138,239 B2Granted
Polymer thermal interface materials
AssigneeIntel Corporation
InventorsEd Prack, Yi Li, Wei Wu
Life of this patent
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Abstract
In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
Claims12
A thermal interface material (TIM) comprising:
- a polymer matrix;
- a matrix additive, wherein the matrix additive comprises a fluxing agent;
- and
- a spherical filler material, wherein the spherical filler material comprises an expanding polymer core with a metallic inner shell and a solder outer shell.
1 more element
A thermal interface material (TIM) comprising:
- a polymer matrix;
- a matrix additive, wherein the matrix additive comprises an antioxidant;
- and
- a spherical filler material, wherein the spherical filler material comprises an expanding polymer core with a metallic inner shell and a solder outer shell.
1 more element
Dependencies are inferred from the claim text.