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US 8,138,081 B2Granted
Aluminum bump bonding for fine aluminum wire
AssigneeFairchild Semiconductor Corporation
InventorsAdams Zhu, Xingquan Fang, Fred Ren, Yongsuk Kwon
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Abstract
The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.
Claims13
A method of packaging a semiconductor device, comprising the steps of:
- providing a leadframe with a semiconductor device attached thereto, the leadframe having a plurality of leads;
- building a first bump on the surface of one or more of the leads;
- forming a substantially flat surface on the first bump with a flat tip wedge tool;
- and
- wire bonding a first end of an aluminum bond wire to the substantially flat surface on the first bump.
2 more elements
Dependencies are inferred from the claim text.