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US 8,138,080 B2Granted
Integrated circuit package system having interconnect stack and external interconnect
AssigneeSTATS ChipPAC, Ltd.
InventorsDario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Emmanuel Espiritu, Rachel Layda Abinan, Allan Ilagan
Life of this patent
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Abstract
An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.
Claims20
A method of manufacturing an integrated circuit package system comprising:
- forming an integrated circuit die having a first bond pad provided thereon;
- forming an interconnect stack having a wire stitch directly on a first external interconnect and a ball bond directly on the wire stitch, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack;
- connecting the interconnect stack to the first bond pad;
- and
- forming an encapsulation covering the integrated circuit die, the interconnect stack, and the first external interconnect with the first external interconnect exposed from the encapsulation.
2 more elements
A method of manufacturing an integrated circuit package system comprising:
- forming an integrated circuit die having a first bond pad provided thereon;
- forming a interconnect stack having a wire stitch directly on a first lead and a ball bond directly on the wire stitch, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack;
- connecting the interconnect stack on a first bond pad;
- and
- forming an encapsulation covering the integrated circuit die, the interconnect stack, and the first lead with the first lead exposed from the encapsulation.
2 more elements
An integrated circuit package system comprising:
- an integrated circuit die having a first bond pad provided thereon;
- an interconnect stack having a wire stitch directly on a first external interconnect and a ball bond directly on the wire stitch, the interconnect stack connected to the first bond pad, the interconnect stack having an equal number of wire stitches and ball bonds with one of the ball bonds as a topmost part of the interconnect stack;
- and
- an encapsulation covering the integrated circuit die, the interconnect stack, and the first external interconnect with the first external interconnect exposed from the encapsulation.
1 more element
Dependencies are inferred from the claim text.