Optical semiconductor device having pre-molded leadframe with window and method therefor

A method of making a semiconductor device, comprising:

• providing an optical semiconductor die that generates electrical signals in response to light;
• providing a leadframe having a light transmitting window, a plurality of contact pads formed as fingers around the light transmitting window, and an elevated area vertically offset with respect to the fingers;
• attaching the optical semiconductor die to the leadframe so that the light transmitting window is aligned to an optically active area of the optical semiconductor die;
• and
• disposing an underfill material between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area.

A method of making a semiconductor package, comprising:

• providing an optical semiconductor die that generates electrical signals in response to light;
• providing a substrate having a plurality of contact pads;
• disposing a light transmitting material between the plurality of contact pads and the substrate, the light transmitting material including an elevated area vertically offset with respect to the substrate;
• and
• attaching the optical semiconductor die to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die.

A method of making a semiconductor package, comprising:

• providing an optical semiconductor die;
• providing a substrate having a plurality of contact pads;
• disposing a light transmitting material between and substantially coplanar with the plurality of contact pads and the substrate;
• attaching the optical semiconductor die to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die;
• forming a plurality of vias in the optical semiconductor die;
• and
• electrically connecting the plurality of vias to the substrate.

A method of making a semiconductor device, comprising:

• providing an optical semiconductor die that generates electrical signals in response to light;
• providing a leadframe having a plurality of contact pads and an elevated area disposed around a light transmitting window;
• attaching the optical semiconductor die to the plurality of contact pads so that the light transmitting window is aligned to an optically active area of the optical semiconductor die;
• and
• disposing an underfill material between the optical semiconductor die and leadframe such that the underfill material contacts a sidewall of the elevated area.