Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

A method of manufacturing semiconductor components, comprising:

• providing an apparatus in which a plurality of dies are to be packaged, the apparatus comprising—
• a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals, and
• a second board having a first side laminated to the front side of the first board, a second side, openings through the second board aligned with individual package areas that define die cavities, and arrays of front contacts at the second side electrically coupled to the second backside terminals by through package interconnects extending through the first board and the second board, wherein the through package interconnects are formed after attaching the front side of the first board to the first side of the second board;
• positioning semiconductor dies in the die cavities;
• electrically coupling bond-pads on the dies to corresponding die contacts of the first board;
• and
• depositing protective material into the die cavities.