Integrated (multilayer) circuits and process of producing the same

A process of forming a semiconductor integrated circuit comprising the steps of:

• forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material;
• forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material;
• positioning the first element relative to the second element;
• bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements;
• wherein the conductive material of the first element physically contacts the conductive material of the second element without deformation or transformation of the conductive materials of the first and second elements and is maintained in position by the bonded polymer layers.